系所成員

陳冠能 (Chen, Kuan-Neng) 教授

陳冠能(Chen, Kuan-Neng)

工程四館 506 室
TEL: (03)5712121 ext. 31558
FAX: (03)5724261
Email: knchen@mail.nctu.edu.tw

個人網頁:

http://integratedcircuit.blog.nctu.edu.tw

實驗室網頁或詳細履歷:

學經歷

  • 國立交通大學國際長, 2019-Now
  • 國立交通大學電子工程系特聘教授, 2018-Now
  • 國立交通大學國際半導體產業學院副院長, 2015-Now
  • 東京工業大學特任教授, 2017-Now
  • 工業技術研究院(ITRI) 合聘正工程師, 2016-Now
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  • IEEE Fellow, “for contributions to 3D integrated circuit and packaging technologies”, 2018.
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  • 國立交通大學電子工程系教授, 2012-2018
  • 國立交通大學電子工程系副教授, 2009-2012
  • IBM T.J. Watson Research Center (華生研究中心) 研究員, 2005-2009
  • INTEL (英代爾) Component Research 研究, 2002
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  • 麻省理工學院(MIT)電機工程與資訊科學系 博士
  • 麻省理工學院(MIT)材料科學與工程系 碩士
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  • 工業技術研究院(ITRI) 無給職特聘研究人員, 2009-2016
  • 國家實驗研究院晶片系統設計中心(CIC) 兼任研究員, 2011-2016
  • MRS Bulletin, 客座編輯, 2015
  • 電子材料與元件協會(EDMA) 秘書長, 2011-2014
  • 日月光交大聯合研發中心 副主任, 2011-2013
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  • 美國科羅拉多大學客座教授, 2017,2018.
  • 美國麻省理工學訪問科學家, 2015.
  • 加拿大英屬哥倫比亞大學客座教授, 2011.
  • IBM TJ Watson Research Center訪問學者, 2010.
  • 新加坡南洋理工大學訪問學者, 2009.
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  • 科技部未來科技突破獎, 2019
  • 科技部傑出研究獎, 2018.
  • IEEE EPS Exceptional Technical Achievement Award, “For contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.”, 2018.
  • 中國工程師學會傑出工程教授獎, 2017.
  • 中國電機工程學會傑出電機工程教授獎, 2014.
  • 台灣電子材料與元件協會傑出服務獎, 2014.
  • 中國電機工程學會優秀青年電機工程師獎,2012.
  • 台灣電子材料與元件協會傑出青年獎, 2010.
  • 研華文教基金會傑出青年教授獎, 2010-2012.
  • IBM Invention Achievement Award, Dec 2006, May 2007, Sep 2007, Dec 2007, Aug 2008.
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  • 第一屆國立交通大學電機資訊年輕學者卓越貢獻獎, 2016
  • 國立交通大學傑出人士榮譽獎勵, 2011起每年
  • 國立交通大學產學技術交流卓越貢獻獎, 2011, 2012, 2014, 2017
  • 國立交通大學績優導師獎, 2013, 2015
  • 國立交通大學電機學院優良教學獎, 2015

研究方向

  • 三維積體電路 (3D IC)
  • 異質整合技術及元件
  • 先進封裝技術

簡介

        Dr. Kuan-Neng Chen received received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Distinguished Professor of Department of Electronics Engineering and Vice Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
        
        Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Plateau Invention Achievement Awards. He has authored 268 publications, including 2 books and 5 book chapters, and holds 80 patents. He was Guest Editor of MRS Bulletin. He served as Program Chair/Co-Chair of IEEE IITC and IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and IEEE Fellow.
        
        In addition to his faculty position, Dr. Chen is currently Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.