演講/活動

2020-03-09 09:10:28翁珮婷109/3/13(五)電子專題討論:歡迎要畢業的碩班與同學博班同學旁聽

台灣積體電路製造股份有限公司-先進技術模組研發處-化學機械研磨部-孫旭昌經理
題目: 台積人的特質
(109/3/13 10:10-12:00 ED116)
(1) 半導體工藝現況與市場需求
(2) 半導體製程概論
(3) 台積電 公司文化
(4) 新人招募 (非官方)

新人招募資訊

(TSMC R&D CMP position )
Responsibility
1. Advanced  module process development and baseline sustaining
2. Process stability/manufacturability improvement for yield and reliability qualification
3. Process/tool transfer to volume manufacturing
 
Requirement:
1. MS or Ph.D. in Electronic Engineering, Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline
2. Hands-on participation and a strong sense of ownership is required
3. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required
4. Excellent written and spoken communication skills are required
5. Experience in IC fabrication would be an added advantage
6. Must be effectively bilingual in Mandarin and English