Faculty

Chen, Kuan-Neng

Chen, Kuan-Neng(陳冠能)

OFFICE: Room 506, Engineering Building 4
TEL: 886-3-5712121 ext. 31558
FAX: 886-3-5724361
E-mail: knchen@mail.nctu.edu.tw

Background

  • Vice President for International Affairs, National Chiao Tung University, 2019-Now
  • Distinguished Professor, Department of Electronics Engineering, National Chiao Tung University, 2018-Now
  • Vice Dean, International College of Semiconductor Technology, National Chiao Tung University, 2015-Now
  • Specially Appointed Professor, Tokyo Institute of Technology (Tokyo Tech), 2017-Now
  • Joint-Appointment R&D Director, Industrial Technology Research Institute (ITRI), 2016-Now
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  • IEEE Fellow, "for contributions to 3D integrated circuit and packaging technologies", 2018.
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  • Professor, Department of Electronics Engineering, National Chiao Tung University, 2012-2018.
  • Associate Professor, Department of Electronics Engineering, National Chiao Tung University, 2009-2012
  • Research Staff Member, IBM T.J. Watson Research Center, 2005-2009.
  • INTEL Component Research, 2002.
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  • Ph.D, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • M.S., Department of Materials Science and Engineering, Massachusetts Institute of Technology
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  • Consultant, Industrial Technology and Research Institute (ITRI), 2009 - 2016.
  • Adjunct Research Staff Member, National Chip Implementation Center, 2013 - 2016.
  • Adjunct Associate Research Staff Member, National Chip Implementation Center, 2012.
  • Guest Editor, MRS Bulletin, 2015.
  • Deputy Director, ASE-NCTU R&D Center, 2011 - 2013.
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  • Visiting Professor, University of Colorado, Boulder, 2017, 2018.
  • Visiting Scientist, Massachusetts Institute of Technology, 2015.
  • Visiting Professor, The University of British Columbia, Vancouver, BC, Canada, 2011.
  • Academic Visitor, IBM T. J. Watson Research Center, 2010.
  • Visiting Researcher, Nanyang Technological University, Singapore, 2009.
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  • Futuristic Breakthrough Technology Award, Future Tech (MOST), 2019.
  • IEEE EPS Exceptional Technical Achievement Award, "For contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies", 2018.
  • MOST Outstanding Research Award, Ministry of Science and Technology, 2018.
  • Outstanding Engineering Professor Award, The Chinese Institute of Engineers (CIE), 2017.
  • Outstanding Electrical Engineering Professor Award, The Chinese Institute of Electrical Engineering (CIEE), 2014.
  • EDMA Outstanding Service Award, 2014.
  • Outstanding Youth Electrical Engineer Award, The Chinese Institute of Electrical Engineering (CICC), 2012.
  • EDMA Outstanding Youth Award, 2010
  • Adventech Young Professor Award, 2010-2012.
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  • NCTU Distinguished Faculty Award, 2011 - now.
  • NCTU EECS Outstanding Young Scholar Award, 2016.
  • NCTU Outstanding Industry-Academia Cooperation Achievement Award, 2011, 2012, 2014, 2016.
  • NCTU Excellent Academic Advisor Award, 2013, 2015, 2016.
  • NCTU College of EE Excellent Teaching Award, 2015.

Research

  • Three-Dimensional Integrated Circuits (3D IC)
  • Heterogeneous Integration
  • Advanced Packaging Technology

Introduction

         Dr. Kuan-Neng Chen received received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Distinguished Professor of Department of Electronics Engineering and Vice Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
        
         Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Plateau Invention Achievement Awards. He has authored 268 publications, including 2 books and 6 book chapters, and holds 80 patents. He was Guest Editor of MRS Bulletin. He served as Program Chair/Co-Chair of IEEE IITC and IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and IEEE Fellow.
        
         In addition to his faculty position, Dr. Chen is currently Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). His current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.

Lab. Website or Detailed C.V.

Course

  • 3D IC
  • Semicondutor Physics and Devices
  • Semicondutor Experiments